LEA’s Heat sink & Vapor Chambers for High-Powered IGBTs.
The current common solution for the thermal management of high-power IGBT modules is to use either larger extruded heat sinks, or to use water cycling cold plates.
“Flaws of these thermal solutions”
Extruded heat sinks have two major flaws for this application which are the inefficiency in heat exchange and its heavy weight.
“Al Vapor chamber Heat sink benefits”
LEA’s solutions include a non-water-based Al vapor chamber heat sink providing an efficient heat exchange solution while eliminating the risk of potential water leakage. Al vapor chambers are also naturally lighter in weight compared to conventional heat sinks.
