Heat pipe-based heat sinks are an older but commonly used thermal device for semiconductors and IC chips. However, faced with high power output, the heat pipe heat sink becomes inefficient due to its limited heat transfer capabilities.
LEA’s Al Vapor Chamber heat sink allows heat to be transported quicker due to the coolant within the chamber. The liquid reacts immediately with heat contact allowing more efficient heat transfer.
With the greater efficiency of heat transfer, the lighter weight of the cooling unit, and the reduced footprint of an Al vapor chamber heat sink, all this contributes to an overall greater efficiency to the heat-producing components in these devices.
Brazing heat exchanger for communication equipment
“Features”
- Manufactured by integrated brazing with aluminum plates and fins.
- Respective manufacturing results done with large brazing furnaces.
“Specification”
- Product No.:J0030106002-01
- Size:W489.2mm×H71.0mmxL415.1mm
- Weight:3,890g
Liquid-cold plate
“Features”
- Product of integrated brazing process using pre-existing aluminum materials.
- High flexibility in designing its internal liquid flow. Braze skive fins, pin fins, etc. to the location of the heat source within the internal structure.
- Compared to conventional products of made by copper pipe and aluminum plate, the volume of this cold plate about 45% less with a reduced weight of approximately 60%.
“Specification”
- Product No.:J0060108003-01
- Weight:2,150g
- Application:Data Centers
